Signal Integrity & Power Integrity

Shrinking timing and noise margins can introduce signal integrity and power integrity issues into your electronic product designs.

ANSYS provides a complete suite of engineering simulation tools to help identify signal integrity and power integrity issues early in the design cycle, for electronics applications including:

  • Printed circuit boards (PCBs)
  • IC packages
  • Connectors
  • Other complex interconnects

ANSYS electromagnetics and circuit simulation products predict EMI/EMC, signal integrity and power integrity — enabling your design team to optimize system performance prior to build and test. Design automation features allow you to import designs from popular layout tools, perform rigorous electromagnetics extraction and then couple to full-circuit simulations.

Memory Channel

With the persistent push for greater bandwidth, memory bus data rates continue to climb. To overcome signal integrity and power integrity challenges, you need more-predictive and accurate analyses to meet market demands.

3-D representation of memory channel analysis, DIMM module for DDR3

High-Speed Serial Channel

ANSYS virtual compliance pass and fail reports are customizable for busses (including PCIe, USB, HDMI, IEEE 802.3 Gigabit Ethernet, etc.) using the ANSYS Nexxim circuit simulator within ANSYS DesignerSI.

Power Integrity & Power Distribution Networks

Shrinking silicon nodes means shrinking power rail supply voltages and noise margins, while the density of transistors increases. The demands for characterizing a power distribution network have never been greater.

EMI & EMC

In typical electronic product design, EMI and EMC are generally neglected until the end of the development cycle. This can result in lengthy delays when violations are found in an anechoic chamber. Predictive signal integrity and power integrity simulations pinpoint problematic radiation within packages, PCBs, connectors and other components.

Chip-Package-Systems

In developing complex electronic systems, the best practice is a simulation- and analysis-driven product design strategy, especially for the IC, package and PCB. Traditional approaches, including “correct by construction” and over-designing, often fall short — especially for advanced silicon nodes. As the number of unique power/ground supply networks in an IC reaches 50 or more, optimizing every (or even one) power delivery network becomes impractical.

ESD Failure

As silicon nodes shrink, susceptibility to failures from electrostatic discharge (ESD) becomes even greater. Engineering simulation software is critical to predicting ESD failure events and troubleshooting causes of ESD, helping to ensure product reliability.